Copper ≥99.95% (metals basis), foil oxygen-free, annealed, Thickness: 0.25 mm (0.01 in)
Supplier: Thermo Scientific
36396.FI
36396.GB
ALFA36396.FIEA
154
SGD
ALFA36396.FI
ALFA36396.GB
Copper ≥99.95% (metals basis), foil oxygen-free, annealed, Thickness: 0.25 mm (0.01 in)
Copper
Purity: 99.95%
CAS No.: 7440-50-8
Physical Form: ≈5.6g/50x50mm
Odour: Odourless
MDL No.: MFCD00010965
Formula:
Cu MW: 63,55 g/mol Boiling Pt: 2595 °C (1013 hPa) Melting Pt: 1083 °C Density: 8,94 g/cm³ (20 °C) Storage Temperature: Ambient |
MDL Number:
MFCD00010965 CAS Number: 7440-50-8 EINECS: 231-159-6 Merck Index: 13,02545 |
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